Tin: Difference between revisions
imported>Milton Beychok m (Corrected formatting of references. The first letter in the names of elements are not capitalized in the text unless the element name is the first word in a sentence.) |
imported>David Yamakuchi m (Fixed Typo and Links) |
||
| Line 21: | Line 21: | ||
Tin is used heavily in many industries, providing (among other uses) a plating which is cost effective in preventing [[rust]] formation on [[iron]] and [[steel]], and as a major component in almost all varieties of [[solder]]. It is also used commonly as a [[catalyst]] for [[silicone]] [[mold making]]. | Tin is used heavily in many industries, providing (among other uses) a plating which is cost effective in preventing [[rust]] formation on [[iron]] and [[steel]], and as a major component in almost all varieties of [[solder]]. It is also used commonly as a [[catalyst]] for [[silicone]] [[mold making]]. | ||
''Pure'' tin however, has been shown<ref>[https://nepp.nasa.gov/whisker/background/ What are Tin Whiskers?] From the website of the National Aeronautics and Space Administration (NASA).</ref> to "grow whiskers" sometimes referred to as "Tin pest" Because of this, pure tin must be used with caution around electronics and electrical circuits, especially in safety related applications. An alloy of tin and lead<ref>[https://nepp.nasa.gov/whisker/photos/pom/2004april.htm Limitation of Hot Solder Dipping for Mitigation of Tin Whisker Formation] From the NASA website.</ref>, or tin and | ''Pure'' tin however, has been shown<ref>[https://nepp.nasa.gov/whisker/background/ What are Tin Whiskers?] From the website of the National Aeronautics and Space Administration (NASA).</ref> to "grow whiskers" sometimes referred to as "Tin pest" Because of this, pure tin must be used with caution around electronics and electrical circuits, especially in safety related applications. An alloy of tin and [[lead]]<ref>[https://nepp.nasa.gov/whisker/photos/pom/2004april.htm Limitation of Hot Solder Dipping for Mitigation of Tin Whisker Formation] From the NASA website.</ref>, or tin and [[bismuth]] are sometimes used<ref>[http://www.reliableplating.com/tin.html Tin Plating] From the NASA website</ref> to help prevent whisker growth. | ||
==References== | ==References== | ||
<references/> | <references/> | ||
Revision as of 13:41, 29 November 2011
| |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Tin is a chemical element, having the chemical symbol Sn. Its atomic number (the number of protons) is 50. It has a standard atomic weight of 118.710(7)g/mol and is a solid at room temperature in its elemental form.
Tin is considered to be a member of the "Post-transition metal" class of elements. At a pressure of 101.325 kPa, it has a boiling point of 2,602°C and a melting point of 231.93°C.
Tin is used heavily in many industries, providing (among other uses) a plating which is cost effective in preventing rust formation on iron and steel, and as a major component in almost all varieties of solder. It is also used commonly as a catalyst for silicone mold making.
Pure tin however, has been shown[1] to "grow whiskers" sometimes referred to as "Tin pest" Because of this, pure tin must be used with caution around electronics and electrical circuits, especially in safety related applications. An alloy of tin and lead[2], or tin and bismuth are sometimes used[3] to help prevent whisker growth.
References
- ↑ What are Tin Whiskers? From the website of the National Aeronautics and Space Administration (NASA).
- ↑ Limitation of Hot Solder Dipping for Mitigation of Tin Whisker Formation From the NASA website.
- ↑ Tin Plating From the NASA website