Tin: Difference between revisions
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'''Tin''' is a [[Chemical elements|chemical element]], having the [[chemical symbol]] Sn. Its [[atomic number]] (the number of [[proton]]s) is 50. It has a [[Atomic mass#Standard atomic weights of the elements|standard atomic weight]] of [[Tin/Atomic mass|{{:Tin/Atomic mass}}]] and is a [[solid]] at [[STP|room temperature]] in its elemental form. | '''Tin''' is a [[Chemical elements|chemical element]], having the [[chemical symbol]] Sn (from the [[Latin]] stannum). Its [[atomic number]] (the number of [[proton]]s) is 50. It has a [[Atomic mass#Standard atomic weights of the elements|standard atomic weight]] of [[Tin/Atomic mass|{{:Tin/Atomic mass}}]] and is a [[solid]] at [[STP|room temperature]] in its elemental form. | ||
Tin is considered to be a member of the "Post-transition metal" class of elements. At a [[pressure]] of 101.325 k[[Pascal (unit)|Pa]], it has a [[boiling point]] of [[Tin/Boiling point|{{:Tin/Boiling point}}]] and a [[melting point]] of [[Tin/Melting point|{{:Tin/Melting point}}]]. | Tin is considered to be a member of the "Post-transition metal" class of elements. At a [[pressure]] of 101.325 k[[Pascal (unit)|Pa]], it has a [[boiling point]] of [[Tin/Boiling point|{{:Tin/Boiling point}}]] and a [[melting point]] of [[Tin/Melting point|{{:Tin/Melting point}}]]. | ||
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Tin is used heavily in many industries, providing (among other uses) a plating which is cost effective in preventing [[rust]] formation on [[iron]] and [[steel]], and as a major component in almost all varieties of [[solder]]. It is also used commonly as a [[catalyst]] for [[silicone]] [[mold making]]. | Tin is used heavily in many industries, providing (among other uses) a plating which is cost effective in preventing [[rust]] formation on [[iron]] and [[steel]], and as a major component in almost all varieties of [[solder]]. It is also used commonly as a [[catalyst]] for [[silicone]] [[mold making]]. | ||
''Pure'' tin however, has been shown<ref>[https://nepp.nasa.gov/whisker/background/ What are Tin Whiskers?] From the website of the National Aeronautics and Space Administration (NASA).</ref> to "grow whiskers" sometimes referred to as "Tin pest" Because of this, pure tin must be used with caution around electronics and electrical circuits, | ''Pure'' tin however, has been shown<ref>[https://nepp.nasa.gov/whisker/background/ What are Tin Whiskers?] From the website of the National Aeronautics and Space Administration (NASA).</ref> to "grow whiskers" sometimes referred to as "[[Tin pest]]" Because of this, pure tin must be used with caution around electronics and electrical circuits, particularly in high voltage and safety related applications. An alloy of tin and [[lead]]<ref>[https://nepp.nasa.gov/whisker/photos/pom/2004april.htm Limitation of Hot Solder Dipping for Mitigation of Tin Whisker Formation] From the NASA website.</ref>, or tin and [[bismuth]] are sometimes used<ref>[http://www.reliableplating.com/tin.html Tin Plating] From the NASA website</ref> to help prevent whisker growth. | ||
==References== | ==References== | ||
<references/> | <references/> | ||
Latest revision as of 10:12, 10 February 2012
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Tin is a chemical element, having the chemical symbol Sn (from the Latin stannum). Its atomic number (the number of protons) is 50. It has a standard atomic weight of 118.710(7)g/mol and is a solid at room temperature in its elemental form.
Tin is considered to be a member of the "Post-transition metal" class of elements. At a pressure of 101.325 kPa, it has a boiling point of 2,602°C and a melting point of 231.93°C.
Tin is used heavily in many industries, providing (among other uses) a plating which is cost effective in preventing rust formation on iron and steel, and as a major component in almost all varieties of solder. It is also used commonly as a catalyst for silicone mold making.
Pure tin however, has been shown[1] to "grow whiskers" sometimes referred to as "Tin pest" Because of this, pure tin must be used with caution around electronics and electrical circuits, particularly in high voltage and safety related applications. An alloy of tin and lead[2], or tin and bismuth are sometimes used[3] to help prevent whisker growth.
References
- ↑ What are Tin Whiskers? From the website of the National Aeronautics and Space Administration (NASA).
- ↑ Limitation of Hot Solder Dipping for Mitigation of Tin Whisker Formation From the NASA website.
- ↑ Tin Plating From the NASA website